A first component includes a slice formed from an integrated circuit chip having a front face and a rear face. An encapsulation block encapsulates the integrated circuit chip such that front and rear faces of the chip and front and rear faces of the encapsulation block are co-planar to form front and rear faces of the slice. Front and rear electrical connection networks are provided on the front and rear faces, respectively, with the electrical connection networks linked by electrical connection vias passing through the encapsulation block. A thermal transfer layer at least partially covers the rear face. A second component may be behind and at a distance from the first component. Connection elements interposed between the first component and the second component include both thermal connection elements in contact with the thermal transfer layer and electrical connection elements interconnecting the first and second components.