发明授权
- 专利标题: Composite processors
- 专利标题(中): 复合处理器
-
申请号: US13978039申请日: 2011-01-20
-
公开(公告)号: US08929694B2公开(公告)日: 2015-01-06
- 发明人: Raymond G Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
- 申请人: Raymond G Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 代理机构: Hewlett-Packard Patent Department
- 代理商 Benjamin Searle
- 国际申请: PCT/US2011/021891 WO 20110120
- 国际公布: WO2012/099590 WO 20120726
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G06F15/80 ; G06F3/00
摘要:
In one example, a composite processor includes a circuit board, a first processor element package, and a second processor element package. The circuit board has an optical link and an electrical link. The first processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The second processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The sub-wavelength grating optical coupler of the first processor element package, the optical link of the circuit board, and the sub-wavelength grating optical coupler of the second processor element package collectively define an optical communications path between the substrate of the first processor element package and the substrate of the second processor element package.
公开/授权文献
- US20130318325A1 COMPOSITE PROCESSORS 公开/授权日:2013-11-28
信息查询