Invention Grant
- Patent Title: Semiconductor circuit system for a composite structure
- Patent Title (中): 用于复合结构的半导体电路系统
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Application No.: US13647813Application Date: 2012-10-09
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Publication No.: US08932905B1Publication Date: 2015-01-13
- Inventor: Morteza Safai
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: H01L51/40
- IPC: H01L51/40 ; H01L21/50 ; H01L23/48 ; H01L27/28 ; H05K1/11 ; H05K3/46
Abstract:
A method and apparatus for forming an organic semiconductor circuit. A circuit printer is positioned relative to a location on a surface of a composite structure. A number of organic materials is deposited in a pattern on the surface of the composite structure at the location to form the organic semiconductor circuit on the surface of the composite structure at the location.
Information query
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