Invention Grant
- Patent Title: Lead frame assembly, LED package and LED light bar
- Patent Title (中): 引线框架组件，LED封装和LED灯条
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Application No.: US13850375Application Date: 2013-03-26
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Publication No.: US08933481B2Publication Date: 2015-01-13
- Inventor: Chiou-Yueh Wang , Chen-Hsiu Lin , Shih-Chang Hsu
- Applicant: Lite-On Electronics (Guangzhou) Limited , Lite-On Technology Corp.
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN201210104900 20120411
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/495 ; H01L27/15 ; H01L25/075 ; F21K99/00 ; F21S4/00 ; F21Y101/02 ; F21Y103/00
Abstract:
A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.
Public/Granted literature
- US20130270588A1 LEAD FRAME ASSEMBLY, LED PACKAGE AND LED LIGHT BAR Public/Granted day:2013-10-17
Information query
IPC分类:
