Invention Grant
- Patent Title: Surface mountable over-current protection device
- Patent Title (中): 表面贴装过流保护装置
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Application No.: US13910880Application Date: 2013-06-05
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Publication No.: US08933775B2Publication Date: 2015-01-13
- Inventor: David Shau Chew Wang , Fu Hua Chu , Chun Teng Tseng
- Applicant: Polytronics Technology Corp.
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corporation
- Current Assignee: Polytronics Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Shimokaji & Associates P.C.
- Priority: TW101136132A 20120928
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H01C7/13 ; H01C7/02 ; H01C1/08 ; H01C1/14 ; H01C17/065

Abstract:
A surface-mountable over-current protection device comprises one PTC material layer, first and second connecting conductors, first and second electrodes and an insulating layer. The PTC material layer has a resistivity less than 0.2 Ω-cm, and comprises crystalline polymer and conductive filler dispersed therein. The first and second connecting conductors are capable of effectively dissipating heat generated from the PTC material layer. The first and second electrodes are electrically connected to first and second surfaces of the PTC material layer through the first and second connecting conductors, respectively. The dissipation factor depending on the ratio of the total area of the electrodes and the conductors to the area of the PTC material layer is greater than 0.6. At 25° C., the value of the hold current of the device divided by the product of the area of the PTC material layer and the number of the PTC material layer is greater than 1A/mm2.
Public/Granted literature
- US20140091896A1 SURFACE MOUNTABLE OVER-CURRENT PROTECTION DEVICE Public/Granted day:2014-04-03
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