A heat-dissipating module is disposed within an electronic device. The heat-dissipating module includes at least one vibration element, a bracket, and a driving unit. The vibration element includes a working part and a free end. The bracket is connected with the working part of the at least one vibration element. The driving unit is connected with the bracket. When the driving unit drives the bracket to vibrate at a vibration frequency, the vibration element is moved with the bracket, and a resonant vibration causes the free end of the vibration element to generate a displacement, so that an airflow is generated at the free end of the vibration element to cool the electronic device.