发明授权
US08935644B2 Printed substrate design system, and printed substrate design method
有权
印刷基板设计系统和印刷基板设计方法
- 专利标题: Printed substrate design system, and printed substrate design method
- 专利标题(中): 印刷基板设计系统和印刷基板设计方法
-
申请号: US14234550申请日: 2012-07-27
-
公开(公告)号: US08935644B2公开(公告)日: 2015-01-13
- 发明人: Masashi Ogawa , Ken Morishita
- 申请人: Masashi Ogawa , Ken Morishita
- 申请人地址: JP
- 专利权人: NEC Corporation
- 当前专利权人: NEC Corporation
- 当前专利权人地址: JP
- 代理机构: Wilmer Cutler Pickering Hale and Dorr LLP
- 优先权: JP2011-166250 20110729
- 国际申请: PCT/JP2012/069228 WO 20120727
- 国际公布: WO2013/018725 WO 20130207
- 主分类号: G06F9/455
- IPC分类号: G06F9/455 ; G06F17/50 ; H05K3/00 ; H05K1/02
摘要:
A printed substrate design system includes: an EMI condition determination unit that compares an EMI characteristic derived by an EMI characteristic derivation unit with an EMI allowable condition, and determines whether the EMI characteristic of a printed substrate satisfies the EMI allowable condition; a substrate configuration change unit that changes an internal configuration of the printed substrate to obtain a changed configuration of the printed substrate in a case where the EMI condition determination unit has determined that the EMI allowable condition is not satisfied, and sets design information of the changed configuration of the printed substrate to design information for deriving the EMI characteristic in the EMI characteristic derivation unit; and an output unit that outputs a printed substrate configuration in a case where the EMI condition determination unit has determined the EMI allowable condition is satisfied.
公开/授权文献
信息查询