发明授权
- 专利标题: Structure and method for topography free SOI integration
- 专利标题(中): 地形自由SOI集成的结构和方法
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申请号: US12958429申请日: 2010-12-02
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公开(公告)号: US08936996B2公开(公告)日: 2015-01-20
- 发明人: Ravi M. Todi , Joseph Ervin , Chengwen Pei , Geng Wang
- 申请人: Ravi M. Todi , Joseph Ervin , Chengwen Pei , Geng Wang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 H. Daniel Schnurmann
- 主分类号: H01L21/76
- IPC分类号: H01L21/76 ; H01L29/02 ; H01L21/762
摘要:
A semiconductor structure is provided that includes a semiconductor oxide layer having features. The semiconductor oxide layer having the features is located between an active semiconductor layer and a handle substrate. The semiconductor structure includes a planarized top surface of the active semiconductor layer such that the semiconductor oxide layer is beneath the planarized top surface. The features within the semiconductor oxide layer are mated with a surface of the active semiconductor layer.
公开/授权文献
- US20120139085A1 Structure and Method for Topography Free SOI Integration 公开/授权日:2012-06-07
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