Invention Grant
- Patent Title: Fluid ejection device
- Patent Title (中): 流体喷射装置
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Application No.: US13834524Application Date: 2013-03-15
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Publication No.: US08939556B2Publication Date: 2015-01-27
- Inventor: Jeffrey R. Pollard , Tsuyoshi Yamashita
- Applicant: Hewlett-Packard Developement Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig & Czaja, PLLC
- Agent Mark A. Peterson
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14

Abstract:
A fluid ejection device includes a flexible membrane, an adhesive layer, a piezoelectric material layer, and first and second electrically conductive layers. The adhesive layer and the piezoelectric material layer include edge regions and central regions. A surface of the edge region of the piezoelectric material layer is coplanar with a surface of the edge region of the adhesive layer. The first electrically conductive layer is between the piezoelectric material layer and the adhesive layer such that a surface of the first electrically conductive layer is coplanar with the surface of the edge region of the piezoelectric material layer and the surface of the edge region of the adhesive layer. The second electrically conductive layer is over the surface of the edge region of the piezoelectric material layer, the surface of the edge region of the adhesive layer, the surface of the first electrically conductive layer, and the flexible membrane.
Public/Granted literature
- US20130200175A1 FLUID EJECTION DEVICE Public/Granted day:2013-08-08
Information query
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