Invention Grant
- Patent Title: Injection mold
- Patent Title (中): 注塑模具
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Application No.: US13315008Application Date: 2011-12-08
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Publication No.: US08939747B2Publication Date: 2015-01-27
- Inventor: Jin Hyun Cho , Jin Sub Kim , Jong Won Lee
- Applicant: Jin Hyun Cho , Jin Sub Kim , Jong Won Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2010-0126246 20101210
- Main IPC: B29C45/73
- IPC: B29C45/73

Abstract:
An injection mold includes a first mold part provided with a first mold surface and a second mold part provided with a second mold surface to form a cavity together with the first mold surface. Cooling channels along which a cooling fluid flows are provided in at least one of the first mold part and the second mold part, and a heat generating layer which receives power and then generates heat is disposed on the inner surfaces of the cooling channels and serves as a heater.
Public/Granted literature
- US20120148699A1 INJECTION MOLD Public/Granted day:2012-06-14
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