Invention Grant
- Patent Title: Bond between components of a medical device
- Patent Title (中): 医疗器械组件之间的结合
-
Application No.: US13676653Application Date: 2012-11-14
-
Publication No.: US08940014B2Publication Date: 2015-01-27
- Inventor: Randy S. Gamarra , David S. Tung , Benjamin Sutton , Takashi Ino , Joshua Wallin , Brian D. Brandt
- Applicant: Boston Scientific Scimed, Inc.
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Seager, Tufte & Wickhem LLC
- Main IPC: A61B17/29
- IPC: A61B17/29 ; A61B17/00 ; A61F2/24 ; A61F2/95

Abstract:
An elongated member and a method of manufacturing an elongated member may include first, second, and third elongated rod mandrels. The first, second, and third elongated rod mandrels may be fixed together at predetermined proximal and distal locations and at a ball tip. The first, second, and third rod mandrels may be disposed within a tubular coupling element and fixed to the tubular coupling element at the ball tip. The tubular coupling element may be placed into abutment with and fixed to the distal end of an elongated shaft.
Public/Granted literature
- US20130123795A1 BOND BETWEEN COMPONENTS OF A MEDICAL DEVICE Public/Granted day:2013-05-16
Information query