Invention Grant
US08940186B2 Insulating layer composition for substrate, and prepreg and substrate using the same
有权
用于基材的绝缘层组合物，以及使用其的预浸料和基材
- Patent Title: Insulating layer composition for substrate, and prepreg and substrate using the same
- Patent Title (中): 用于基材的绝缘层组合物，以及使用其的预浸料和基材
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Application No.: US13657296Application Date: 2012-10-22
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Publication No.: US08940186B2Publication Date: 2015-01-27
- Inventor: Soo Young Ji , Suk Jin Ham , Seung Hwan Kim , Do Young Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2011-0109373 20111025
- Main IPC: C09K19/34
- IPC: C09K19/34 ; C09K19/06 ; C08G61/02 ; C08J3/00 ; C09K5/00 ; C08K5/15 ; D21H17/17 ; C08K5/1515 ; H05K1/03 ; C08J5/24 ; C09K19/38 ; C09D167/02 ; C09D177/00 ; C09D177/10 ; C09D179/08 ; C08G73/12
Abstract:
Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same.The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.
Public/Granted literature
- US20130099149A1 INSULATING LAYER COMPOSITION FOR SUBSTRATE, AND PREPEG AND SUBSTRATE USING THE SAME Public/Granted day:2013-04-25
Information query
