Invention Grant
- Patent Title: Alloy wire and methods for manufacturing the same
- Patent Title (中): 合金线及其制造方法
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Application No.: US13495800Application Date: 2012-06-13
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Publication No.: US08940403B2Publication Date: 2015-01-27
- Inventor: Jun-Der Lee , Hsing-Hua Tsai , Tung-Han Chuang
- Applicant: Jun-Der Lee , Hsing-Hua Tsai , Tung-Han Chuang
- Applicant Address: TW Taichung
- Assignee: Wire Technology Co., Ltd.
- Current Assignee: Wire Technology Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW101100014A 20120102
- Main IPC: B32B15/02
- IPC: B32B15/02 ; B32B15/01 ; C22F1/14 ; C22C5/06 ; H01L23/00

Abstract:
An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
Public/Granted literature
- US20130171470A1 ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2013-07-04
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