发明授权
- 专利标题： Method of diced wafer transportation
- 专利标题（中）： 切片晶片运输方法
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申请号： US13917973申请日： 2013-06-14
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公开(公告)号： US08940619B2公开(公告)日： 2015-01-27
- 发明人: Wei-Sheng Lei , Brad Eaton , Aparna Iyer , Saravjeet Singh , Todd Egan , Ajay Kumar , Seshadri Ramaswami
- 申请人： Wei-Sheng Lei , Brad Eaton , Aparna Iyer , Saravjeet Singh , Todd Egan , Ajay Kumar , Seshadri Ramaswami
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely Sokoloff Taylor Zafman LLP
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/463 ; H01L21/47 ; H01L21/475 ; H01L21/82 ; H01L21/56 ; H01L21/683
摘要：
Methods of dicing semiconductor wafers, and transporting singulated die, are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.
公开/授权文献
- US20140015109A1 METHOD OF DICED WAFER TRANSPORTATION 公开/授权日：2014-01-16
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