发明授权
- 专利标题： Methods of forming semiconductor modules including flexible panels
- 专利标题（中）： 形成包括柔性板的半导体模块的方法
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申请号： US13531983申请日： 2012-06-25
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公开(公告)号： US08940621B2公开(公告)日： 2015-01-27
- 发明人: Sang-Uk Han , Jeong-Kyu Ha , Youngshin Kwon , Seung Hwan Kim , KwanJai Lee
- 申请人： Sang-Uk Han , Jeong-Kyu Ha , Youngshin Kwon , Seung Hwan Kim , KwanJai Lee
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： F. Chau & Associates, LLC
- 优先权： KR10-2011-0064612 20110630
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/56 ; H01L23/00 ; H01L21/683
摘要：
Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.
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