Invention Grant
- Patent Title: Metal bumps for cooling device connection
- Patent Title (中): 用于冷却装置连接的金属凸块
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Application No.: US13034263Application Date: 2011-02-24
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Publication No.: US08941232B2Publication Date: 2015-01-27
- Inventor: You-Hua Chou , Yi-Jen Lai , Chun-Jen Chen , Perre Kao
- Applicant: You-Hua Chou , Yi-Jen Lai , Chun-Jen Chen , Perre Kao
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/367 ; H01L23/42
Abstract:
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps.
Public/Granted literature
- US20120217628A1 METAL BUMPS FOR COOLING DEVICE CONNECTION Public/Granted day:2012-08-30
Information query
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