Invention Grant
- Patent Title: Multilayered printed wiring board
- Patent Title (中): 多层印刷线路板
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Application No.: US13766809Application Date: 2013-02-14
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Publication No.: US08942003B2Publication Date: 2015-01-27
- Inventor: Takahiro Sahara , Atsushi Kobayashi , Kiyoshi Takeuchi , Masahiko Igaue
- Applicant: Takahiro Sahara , Atsushi Kobayashi , Kiyoshi Takeuchi , Masahiko Igaue
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-205641 20060728
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46 ; H05K1/02 ; H05K1/03 ; H05K3/28 ; H05K3/40
Abstract:
A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
Public/Granted literature
- US20130220686A1 MULTILAYERED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-08-29
Information query
