发明授权
- 专利标题： Pattern measuring apparatus, and pattern measuring method and program
- 专利标题（中）： 图案测量装置，图案测量方法和程序
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申请号： US13700018申请日： 2011-03-28
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公开(公告)号： US08942464B2公开(公告)日： 2015-01-27
- 发明人: Takuma Shibahara , Tsuyoshi Minakawa , Michio Oikawa , Yutaka Hojo , Hitoshi Sugahara , Hiroyuki Shindo
- 申请人： Takuma Shibahara , Tsuyoshi Minakawa , Michio Oikawa , Yutaka Hojo , Hitoshi Sugahara , Hiroyuki Shindo
- 申请人地址： JP Tokyo
- 专利权人： Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi High-Technologies Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Foley & Lardner LLP
- 优先权： JP2010-126407 20100602
- 国际申请： PCT/JP2011/057654 WO 20110328
- 国际公布： WO2011/152106 WO 20111208
- 主分类号： G06T7/00
- IPC分类号： G06T7/00 ; G01B21/20 ; H01J37/22 ; H01J37/28 ; H01L21/66
摘要：
The present invention provides a pattern measuring apparatus (600) that: acquires the image contour of a circuit pattern formed by transferring design data; classifies the acquired image contour into shape structures; calculates normal vectors for each shape structure; maps the shape structures to the image contour; uses at least one normal direction for each shape structure to stabilize the normal directions to the image contour; and uses the normal vectors for each shape structure to determine the position of a SEM contour.
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