Invention Grant
- Patent Title: Transponder embedded in a flexible multilayer support
- Patent Title (中): 转发器嵌入在一个灵活的多层支持中
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Application No.: US11870969Application Date: 2007-10-11
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Publication No.: US08946099B2Publication Date: 2015-02-03
- Inventor: Manfred Michalk
- Applicant: Manfred Michalk
- Applicant Address: DE
- Assignee: HID Global GmbH
- Current Assignee: HID Global GmbH
- Current Assignee Address: DE
- Agency: Sheridan Ross P.C.
- Priority: EP06122209 20061012
- Main IPC: B32B3/10
- IPC: B32B3/10 ; B32B27/12 ; B42D15/00 ; B42D25/00 ; G06K19/077
Abstract:
The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.
Public/Granted literature
- US20080131669A1 TRANSPONDER EMBEDDED IN A FLEXIBLE MULTILAYER SUPPORT Public/Granted day:2008-06-05
Information query
