A protector module for use with a communication system, such as a telephone system having a tip line and a ring line, includes a base member and a plurality of electrically conductive pins mounted on the base member. A first electrical contact is fixedly mounted on the top surface of the base member and is in electrical communication with one of the tip line and the ring line. A movable second electrical contact is connected to a ground pin mounted on the base member and is situated in alignment with the first electrical contact. A solder pellet, which may melt in high current, long duration power surges, and a solid state device, are positioned between the first and second electrical contacts.