发明授权
US08947887B2 Package assembly and method of tuning a natural resonant frequency of a package
有权
包装组装和调谐包装的固有共振频率的方法
- 专利标题： Package assembly and method of tuning a natural resonant frequency of a package
- 专利标题（中）： 包装组装和调谐包装的固有共振频率的方法
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申请号： US13142857申请日： 2009-02-23
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公开(公告)号： US08947887B2公开(公告)日： 2015-02-03
- 发明人: Robert Bauer , Thorsten Hauck
- 申请人： Robert Bauer , Thorsten Hauck
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 国际申请： PCT/IB2009/050724 WO 20090223
- 国际公布： WO2010/095006 WO 20100826
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L23/495
摘要：
A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.