An apparatus and a method for cooling a super conducting machine are disclosed, in which at least two condenser areas each make thermal contact with a cold head, and in which the at least two condenser areas each have a connecting line, via which the at least two condenser areas are connected fluidically to an evaporator area. A liquid cooling fluid can be moved or pumped from at least one condenser area into the evaporator area by way of a temperature difference, and a pressure difference associated therewith, in the at least two condenser areas.