Invention Grant
US08950068B2 Systems and methods for encapsulating electronics in a mountable device
有权
将电子元件封装在可安装设备中的系统和方法
- Patent Title: Systems and methods for encapsulating electronics in a mountable device
- Patent Title (中): 将电子元件封装在可安装设备中的系统和方法
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Application No.: US14032428Application Date: 2013-09-20
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Publication No.: US08950068B2Publication Date: 2015-02-10
- Inventor: James Etzkorn
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; A61B5/145 ; A61B5/1473 ; A61B5/00 ; H05K3/32

Abstract:
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.
Public/Granted literature
- US20140296673A1 Systems and Methods for Encapsulating Electronics in a Mountable Device Public/Granted day:2014-10-02
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