发明授权
- 专利标题: Method for manufacturing glass sealed body and method for manufacturing light-emitting device
- 专利标题(中): 制造玻璃密封体的方法及其制造方法
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申请号: US13468607申请日: 2012-05-10
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公开(公告)号: US08950216B2公开(公告)日: 2015-02-10
- 发明人: Koichiro Tanaka
- 申请人: Koichiro Tanaka
- 申请人地址: JP
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Husch Blackwell LLP
- 优先权: JP2011-107804 20110513
- 主分类号: C03B23/207
- IPC分类号: C03B23/207 ; C03B23/24 ; C03C27/06 ; H01L51/52 ; H01J9/24
摘要:
In a method for manufacturing a glass sealed body, a paste including powdered glass and a binder is discharged from an outlet whose shape is a closed curve to form a partition whose shape is a closed curve over a first glass substrate; the partition is heated so that the binder is volatilized and the powdered glass is fused to be a frit glass; and the frit glass and a second glass substrate are heated while disposing in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate. A light-emitting element is sealed with the glass sealed body, so that the sealing is hardly broken even when impact or external force is applied.
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