Invention Grant
- Patent Title: Bending press system
- Patent Title (中): 弯曲印刷机系统
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Application No.: US13517797Application Date: 2012-06-14
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Publication No.: US08950228B2Publication Date: 2015-02-10
- Inventor: Mun Yong Lee , Sang Jin Ha
- Applicant: Mun Yong Lee , Sang Jin Ha
- Applicant Address: KR Busan
- Assignee: Sungwoo Hitech Co., Ltd.
- Current Assignee: Sungwoo Hitech Co., Ltd.
- Current Assignee Address: KR Busan
- Agency: Lexyoume IP Meister, PLLC
- Priority: KR10-2012-0031432 20120328
- Main IPC: B21D11/00
- IPC: B21D11/00

Abstract:
A bending press system is disclosed. The bending press system may include: at least one guide post; a slide plate mounted at a slider so as to be slidable upwardly or downwardly along the guide post; a bending die including a lower die having an upper surface and an upper die having a lower surface corresponding to the upper surface of the lower die and mounted on a lower surface of the slide plate, and adapted to bend an object supplied between the lower die and the upper die to have a predetermined curvature; and a pair of clamping means mounted respectively at both sides of the bending die corresponding to the bending die and adapted to clamp both end portions of the object.
Public/Granted literature
- US20130255349A1 BENDING PRESS SYSTEM Public/Granted day:2013-10-03
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