Invention Grant
US08951554B2 Microcapsule, structure having a microcapsule, article having a microcapsule, and method of preparing microcapsules
有权
微胶囊，具有微胶囊的结构，具有微胶囊的制品和制备微胶囊的方法
- Patent Title: Microcapsule, structure having a microcapsule, article having a microcapsule, and method of preparing microcapsules
- Patent Title (中): 微胶囊，具有微胶囊的结构，具有微胶囊的制品和制备微胶囊的方法
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Application No.: US12457235Application Date: 2009-06-04
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Publication No.: US08951554B2Publication Date: 2015-02-10
- Inventor: Jong-jin Park , Jong-min Kim , Sung-ho Jin
- Applicant: Jong-jin Park , Jong-min Kim , Sung-ho Jin
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0107969 20081031
- Main IPC: A61K8/11
- IPC: A61K8/11 ; A61K8/27 ; A61K8/29 ; A61K8/19 ; A61K8/28 ; A61K8/73 ; A61K9/50 ; A61K9/00 ; A61Q13/00 ; A61Q15/00 ; C01G23/00 ; C01G49/00 ; C01G49/06 ; C01G51/00 ; C01G53/00 ; H01F1/28 ; H01F1/34 ; H01F1/36
Abstract:
A microcapsule, a structure including a microcapsule, an article including a microcapsule and a method of preparing microcapsules provided, the microcapsule includes at least one material selected from the group consisting of a magnetic substance, a dielectric substance and a combination thereof. The microcapsule also includes a volatile material.
Public/Granted literature
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