Invention Grant
US08956712B2 Solid state power source with frames for attachment to an electronic circuit
有权
具有用于附接到电子电路的框架的固态电源
- Patent Title: Solid state power source with frames for attachment to an electronic circuit
- Patent Title (中): 具有用于附接到电子电路的框架的固态电源
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Application No.: US13692729Application Date: 2012-12-03
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Publication No.: US08956712B2Publication Date: 2015-02-17
- Inventor: Michael W. Barror , John K. Day , Shawn W. Snyder , Alexandra Z. LaGuardia , Damon E. Lytle , Bernd J. Neudecker
- Applicant: Infinite Power Solutions, Inc. , Medtronic, Inc.
- Applicant Address: US MN Minneapolis US DE Wilmington
- Assignee: Medtronic, Inc.,Sapurast Research LLC
- Current Assignee: Medtronic, Inc.,Sapurast Research LLC
- Current Assignee Address: US MN Minneapolis US DE Wilmington
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01M2/18
- IPC: H01M2/18 ; H01M2/02 ; A61N1/378 ; H01M10/04 ; H01M10/056 ; H01M6/18
Abstract:
A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.
Public/Granted literature
- US20140154553A1 SOLID STATE POWER SOURCE WITH FRAMES FOR ATTACHMENT TO AN ELECTRONIC CIRCUIT Public/Granted day:2014-06-05
Information query
