Invention Grant
US08957695B2 Semiconductor device having plural semiconductor chip stacked with one another 有权
具有彼此堆叠的多个半导体芯片的半导体器件

Semiconductor device having plural semiconductor chip stacked with one another
Abstract:
Disclosed herein is a device that includes: external terminals; a first chip including a first control circuit that generates a first control signal; and a second chip stacked with the first chip. The second chip includes: a first test terminal supplied with a first test signal and being free from connecting to any one of the external terminals; a second test terminal supplied with the first test signal and coupled to one of the external terminals without connecting to any one of control circuits of the first chip; a first normal terminal supplied with the first control signal and coupled to another of the external terminals with an intervention of the first control circuit of the first chip; and a first selection circuit including first input node coupled in common to the first and second test terminals and the second input node coupled to the first normal terminal.
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