Invention Grant
US08957695B2 Semiconductor device having plural semiconductor chip stacked with one another
有权
具有彼此堆叠的多个半导体芯片的半导体器件
- Patent Title: Semiconductor device having plural semiconductor chip stacked with one another
- Patent Title (中): 具有彼此堆叠的多个半导体芯片的半导体器件
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Application No.: US13720863Application Date: 2012-12-19
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Publication No.: US08957695B2Publication Date: 2015-02-17
- Inventor: Tetsuji Takahashi , Toru Ishikawa
- Applicant: Elpida Memory, Inc.
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.A.R.L
- Current Assignee: PS4 Luxco S.A.R.L
- Current Assignee Address: LU Luxembourg
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-278311 20111220
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L25/18 ; H01L23/31 ; H01L23/00

Abstract:
Disclosed herein is a device that includes: external terminals; a first chip including a first control circuit that generates a first control signal; and a second chip stacked with the first chip. The second chip includes: a first test terminal supplied with a first test signal and being free from connecting to any one of the external terminals; a second test terminal supplied with the first test signal and coupled to one of the external terminals without connecting to any one of control circuits of the first chip; a first normal terminal supplied with the first control signal and coupled to another of the external terminals with an intervention of the first control circuit of the first chip; and a first selection circuit including first input node coupled in common to the first and second test terminals and the second input node coupled to the first normal terminal.
Public/Granted literature
- US20130153898A1 SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIP STACKED WITH ONE ANOTHER Public/Granted day:2013-06-20
Information query
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