Invention Grant
- Patent Title: Compact ejectable component assemblies in electronic devices
- Patent Title (中): 电子设备中紧凑型可拆卸组件
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Application No.: US13914100Application Date: 2013-06-10
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Publication No.: US08960818B2Publication Date: 2015-02-24
- Inventor: Scott A. Myers , Erik L. Wang , Jason S. Sloey
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G06K13/08 ; H04M1/02
Abstract:
Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
Public/Granted literature
- US20130300272A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2013-11-14
Information query
