Invention Grant
- Patent Title: Pressure-sensitive adhesives for bonding printing plates
- Patent Title (中): 粘合印版的压敏粘合剂
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Application No.: US12717183Application Date: 2010-03-04
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Publication No.: US08962777B2Publication Date: 2015-02-24
- Inventor: Kai Ellringmann , Marco Kupsky
- Applicant: Kai Ellringmann , Marco Kupsky
- Applicant Address: DE Hamburg
- Assignee: tesa SE
- Current Assignee: tesa SE
- Current Assignee Address: DE Hamburg
- Agency: Norris McLaughlin & Marcus, P.A.
- Priority: DE102009011482 20090306
- Main IPC: C08F120/06
- IPC: C08F120/06 ; C09J133/08 ; B32B37/12 ; B41N6/02

Abstract:
Crosslinked pressure-sensitive adhesive comprising at least one base polymer component obtainable by free-radical copolymerization of the following monomers: a) linear acrylic esters having 2 to 10 C atoms in the alkyl radical, b) branched, non-cyclic acrylic esters having a glass transition temperature Tg (based on the DSC measurement to DIN 53765) of not more than −20° C., c) 8% to 15% by weight of acrylic acid, d) optionally up to 10% by weight of further copolymerizable monomers, characterized in that the ratio of the linear acrylic esters to the branched acrylic esters is in the range from 1:6 to 10:1 mass fractions.
Public/Granted literature
- US20110166311A1 PRESSURE-SENSITIVE ADHESIVES FOR BONDING PRINTING PLATES Public/Granted day:2011-07-07
Information query
IPC分类: