Invention Grant
- Patent Title: Boosting circuit
- Patent Title (中): 升压电路
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Application No.: US13966023Application Date: 2013-08-13
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Publication No.: US08963624B2Publication Date: 2015-02-24
- Inventor: Hiroki Murakami
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Windbond Electronics Corp.
- Current Assignee: Windbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2011-141328 20110627
- Main IPC: G11C7/12
- IPC: G11C7/12 ; G05F1/46 ; H02M3/07

Abstract:
A boosting circuit, includes an output circuit including a first transmission circuit, transmitting charges of a first boosting node to a first output node according to a first transmission control signal, a detection circuit, detecting the voltage level of the first output node, and a pre-charge circuit pre-charging the first boosting node according a detection signal of the detection circuit; a first pump circuit includes a second transmission circuit, transmitting charges to a second output node according to a second transmission control signal, and a first capacitance unit, coupled to the first boosting node, boosting the voltage level of the first boosting node according to charges transmitted in the second output node; and a control circuit, coupled to the output circuit and the first pump circuit, controls the second transmission control signal according to the voltage level of the first output node.
Public/Granted literature
- US20140035663A1 Boosting Circuit Public/Granted day:2014-02-06
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