Invention Grant
US08964772B2 Method for implementing a multi-chip module with a high-rate interface
有权
用于实现具有高速率接口的多芯片模块的方法
- Patent Title: Method for implementing a multi-chip module with a high-rate interface
- Patent Title (中): 用于实现具有高速率接口的多芯片模块的方法
-
Application No.: US13648227Application Date: 2012-10-09
-
Publication No.: US08964772B2Publication Date: 2015-02-24
- Inventor: William Calvin Woodruff
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: McDermott Will & Emery LLP
- Main IPC: H04L12/28
- IPC: H04L12/28

Abstract:
A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.
Public/Granted literature
- US20140098825A1 METHOD FOR IMPLEMENTING A MULTI-CHIP MODULE WITH A HIGH-RATE INTERFACE Public/Granted day:2014-04-10
Information query