Invention Grant
- Patent Title: Cover apparatus for electronic device
- Patent Title (中): 电子装置封盖装置
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Application No.: US13867657Application Date: 2013-04-22
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Publication No.: US08967425B2Publication Date: 2015-03-03
- Inventor: Wan-Hyoung Lee
- Applicant: Samsung Electronics Co. Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2012-0095580 20120830
- Main IPC: B65D43/16
- IPC: B65D43/16 ; B65D43/24 ; H05K5/02 ; B65D43/22
Abstract:
A cover apparatus for an electronic device is provided. The cover apparatus includes a cover configured to be pivotably coupled to a body of the electronic device to open or close a portion of the body, and an elastic member, one end of which is supported by the cover, and the other end of which is supported by the body. The elastic member provides a driving force to pivot the cover in a direction for opening the portion of the body, and the cover includes a seating portion configured to fix the one end of the elastic member.
Public/Granted literature
- US20140061216A1 COVER APPARATUS FOR ELECTRONIC DEVICE Public/Granted day:2014-03-06
Information query
