Invention Grant
- Patent Title: Folding SO-DIMM socket
- Patent Title (中): 折叠SO-DIMM插座
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Application No.: US13657329Application Date: 2012-10-22
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Publication No.: US08968019B2Publication Date: 2015-03-03
- Inventor: Paul J. Hack , Joshua Funamura , George V. Anastas , Zheng Gao , Gregory A. Springer , Erik James Shahoian
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H05K7/14 ; G06F1/18

Abstract:
Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.
Public/Granted literature
- US20130288492A1 FOLDING SO-DIMM SOCKET Public/Granted day:2013-10-31
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