发明授权
- 专利标题： Bump structures for semiconductor package
- 专利标题（中）： 半导体封装的凸块结构
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申请号： US13624356申请日： 2012-09-21
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公开(公告)号： US08970035B2公开(公告)日： 2015-03-03
- 发明人: Jing-Cheng Lin , Po-Hao Tsai
- 申请人： Jing-Cheng Lin , Po-Hao Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A package structure includes a first substrate bonded to a second substrate by Connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate. A first solder joint region is formed between metal pillar and the first connector, and a second solder joint region is formed between the second metal pillar and the second connector. The thickness of the first metal pillar is greater than the thickness of the second metal pillar.
公开/授权文献
- US20140061897A1 Bump Structures for Semiconductor Package 公开/授权日：2014-03-06
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