发明授权
- 专利标题： Package for semiconductor light-emitting device and light-emitting device
- 专利标题（中）： 用于半导体发光器件和发光器件的封装
-
申请号： US13665696申请日： 2012-10-31
-
公开(公告)号： US08975657B2公开(公告)日： 2015-03-10
- 发明人: Yukinari Haraguchi , Takeshi Otsu , Yutaka Mori , Tadahiro Katsumoto
- 申请人： Mitsubishi Chemical Corporation
- 申请人地址： unknown Chiyoda-ky
- 专利权人： Mitsubishi Chemical Corporation
- 当前专利权人： Mitsubishi Chemical Corporation
- 当前专利权人地址： unknown Chiyoda-ky
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-104490 20100428
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L33/48 ; H01L23/00
摘要：
An object of the present invention is to provide a package from which a metal wiring and the like are difficult to be detached even when heat is generated from a semiconductor light-emitting element. This object is achieved with a package for a semiconductor light-emitting device comprising at least a molded resin containing (A) a SiH-containing polyorganosiloxane and (B) a filler, wherein an amount of SiH existing in the molded resin, after a heat treatment thereof at 200° C. for 10 minutes, is 20 to 65 μmol/g.
公开/授权文献
信息查询
IPC分类:
