发明授权
US08975758B2 Semiconductor package having interposer with openings containing conductive layer
有权
具有插入器的半导体封装件，其具有包含导电层的开口
- 专利标题： Semiconductor package having interposer with openings containing conductive layer
- 专利标题（中）： 具有插入器的半导体封装件，其具有包含导电层的开口
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申请号： US13337197申请日： 2011-12-26
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公开(公告)号： US08975758B2公开(公告)日： 2015-03-10
- 发明人: Seung Hyun Lee
- 申请人： Seung Hyun Lee
- 申请人地址： KR Gyeonggi-do
- 专利权人： SK Hynix Inc.
- 当前专利权人： SK Hynix Inc.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： William Park & Associates Patent Ltd.
- 优先权： KR10-2011-0094541 20110920
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/02 ; H01L23/34 ; H01L23/498 ; H01L23/31
摘要：
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings.
公开/授权文献
- US20130069226A1 SEMICONDUCTOR PACKAGE HAVING INTERPOSER 公开/授权日：2013-03-21
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