Invention Grant
US08975758B2 Semiconductor package having interposer with openings containing conductive layer
有权
具有插入器的半导体封装件，其具有包含导电层的开口
- Patent Title: Semiconductor package having interposer with openings containing conductive layer
- Patent Title (中): 具有插入器的半导体封装件，其具有包含导电层的开口
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Application No.: US13337197Application Date: 2011-12-26
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Publication No.: US08975758B2Publication Date: 2015-03-10
- Inventor: Seung Hyun Lee
- Applicant: Seung Hyun Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2011-0094541 20110920
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/02 ; H01L23/34 ; H01L23/498 ; H01L23/31
Abstract:
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings.
Public/Granted literature
- US20130069226A1 SEMICONDUCTOR PACKAGE HAVING INTERPOSER Public/Granted day:2013-03-21
Information query
IPC分类:
