Invention Grant
- Patent Title: Shear-layer chuck for lithographic apparatus
- Patent Title (中): 用于光刻设备的剪切层卡盘
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Application No.: US14259723Application Date: 2014-04-23
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Publication No.: US08976336B2Publication Date: 2015-03-10
- Inventor: Samir A. Nayfeh , Mark Edd Williams , Justin Matthew Verdirame
- Applicant: ASML Holding N.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Holding N.V.
- Current Assignee: ASML Holding N.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/687 ; H01L21/683

Abstract:
A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.
Public/Granted literature
- US20140233009A1 Shear-Layer Chuck for Lithographic Apparatus Public/Granted day:2014-08-21
Information query
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