Invention Grant
- Patent Title: Headset microphone boom assembly
- Patent Title (中): 耳机麦克风支架总成
-
Application No.: US14028986Application Date: 2013-09-17
-
Publication No.: US08976957B2Publication Date: 2015-03-10
- Inventor: Peter Pavlov , Peng Jiang , Ryan Patrick Rye
- Applicant: Motorola Mobility LLC
- Applicant Address: US CA Mountain View
- Assignee: Google Technology Holdings LLC
- Current Assignee: Google Technology Holdings LLC
- Current Assignee Address: US CA Mountain View
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M9/00 ; H04R1/00 ; H04R25/00 ; H04R1/10 ; H04R1/32

Abstract:
The present arrangements relate to a microphone boom assembly. A first microphone can be positioned proximate to a first aperture defined in a first side of the microphone boom through which acoustic signals propagate to the first microphone, and a second microphone can be positioned proximate to a second aperture defined in a second side of the microphone through which the acoustic signals propagate to the second microphone. The first microphone can be connected to a first side of a flexible printed circuit at a first location and the second microphone connected to a second side of the flexible printed circuit at a second location, the flexible printed circuit mounted into the microphone boom with a bend in the flexible printed circuit positioned between the first location and the second location.
Public/Granted literature
- US20140341389A1 HEADSET MICROPHONE BOOM ASSEMBLY Public/Granted day:2014-11-20
Information query