Invention Grant
- Patent Title: Through-holed interposer, packaging substrate, and methods of fabricating the same
- Patent Title (中): 通孔插入器，封装衬底及其制造方法
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Application No.: US13845625Application Date: 2013-03-18
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Publication No.: US08981570B2Publication Date: 2015-03-17
- Inventor: Tzyy-Jang Tseng , Dyi-Chung Hu , Ying-Chih Chan
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101126991A 20120726
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768 ; H01L21/56 ; H01L23/31 ; H01L25/065 ; H01L23/00
Abstract:
A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.
Public/Granted literature
- US20140027925A1 THROUGH-HOLED INTERPOSER, PACKAGING SUBSTRATE, AND METHODS OF FABRICATING THE SAME Public/Granted day:2014-01-30
Information query
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