Invention Grant
- Patent Title: 3D memory array with read bit line shielding
- Patent Title (中): 具有读取位线屏蔽的3D存储器阵列
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Application No.: US14066450Application Date: 2013-10-29
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Publication No.: US08982622B2Publication Date: 2015-03-17
- Inventor: Shuo-Nan Hung
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Agent James F. Hann
- Main IPC: G11C16/04
- IPC: G11C16/04 ; H01L27/115 ; H01L23/522

Abstract:
A memory device includes a block of memory cells having a plurality of levels. Each level includes strips of memory cells extending in a first direction between first and second ends of the block. A first bit line structure, at each level at the first end, is coupled to a first string of memory cells extending from the first end. A second bit line structure, at each level at the second end, is coupled to a second string of memory cells extending from said second end. Bit line pairs extend in the first direction with each including odd and even bit lines. Odd and even bit line connectors connect the odd and even bit lines to the second and first bit line structures, respectively. Each bit line for a series of bit line pairs are separated by a bit line of an adjacent pair of bit lines.
Public/Granted literature
- US20140056072A1 3D MEMORY ARRAY WITH READ BIT LINE SHIELDING Public/Granted day:2014-02-27
Information query