Invention Grant
- Patent Title: Optical board, method of manufacturing the optical board and optical module structure
- Patent Title (中): 光板,光板的制造方法和光模块结构
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Application No.: US13780798Application Date: 2013-02-28
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Publication No.: US08983245B2Publication Date: 2015-03-17
- Inventor: Hiroki Yasuda , Hiroshi Ishikawa , Kouki Hirano
- Applicant: Hitachi Cable, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Priority: JP2012-226825 20121012
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02B6/12 ; G02B6/42 ; G02B6/38 ; G02B6/13

Abstract:
An optical board includes a plate-shaped resin base material including a slit-shaped optical fiber housing portion formed thereon, a metal layer formed on a surface of the based material, and a reflective layer for reflecting light propagating in an optical fiber housed in the optical fiber housing portion. The base material further includes an inclined surface inclined with respect to the surface of the base material at a terminal end of the optical fiber housing portion. The reflective layer is formed over an end face of the metal layer and the inclined surface, the end face forming a flat surface continuously with the inclined surface.
Public/Granted literature
- US20140105536A1 OPTICAL BOARD, METHOD OF MANUFACTURING THE OPTICAL BOARD AND OPTICAL MODULE STRUCTURE Public/Granted day:2014-04-17
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