Invention Grant
- Patent Title: Assembled packing case
- Patent Title (中): 组装包装箱
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Application No.: US13825007Application Date: 2013-02-01
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Publication No.: US08985332B2Publication Date: 2015-03-24
- Inventor: Yi-cheng Kuo , Shih Hsiang Chen , Jiaxin Li
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen
- International Application: PCT/CN2013/071283 WO 20130201
- International Announcement: WO2014/114014 WO 20140731
- Main IPC: B65D85/48
- IPC: B65D85/48 ; B65D81/02 ; B65D6/00

Abstract:
The present invention relates to an assembled packing case, which comprises a bottom component with a criss-cross underside, corner components embedded to vacant corners of the bottom component, and limiting holes provided at embedding positions between the bottom component and the corner components; wherein the assembled packing case further comprises fasteners inserted into the limiting holes to define the relative position between the bottom component and the corner components; the bottom component and the corner components are set as mortise and tenon structures at the embedding positions, and the mortise and tenon structures limit the relative displacement between the bottom component and corner components in the vertical direction; and the corner components are embedded to the bottom component to form a case body by the mortise and tenon structures. The structure of the assembled packing case is simple and the cost is low.
Public/Granted literature
- US20140202909A1 ASSEMBLED PACKING CASE Public/Granted day:2014-07-24
Information query
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