Invention Grant
- Patent Title: Heat-dissipating element, manufacturing method and backlight module thereof
- Patent Title (中): 散热元件,制造方法及其背光模块
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Application No.: US13699701Application Date: 2012-10-31
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Publication No.: US08985800B2Publication Date: 2015-03-24
- Inventor: Chong Huang , Yuchun Hsiao
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201210397053 20121018
- International Application: PCT/CN2012/083824 WO 20121031
- International Announcement: WO2014/059699 WO 20140424
- Main IPC: F28F3/02
- IPC: F28F3/02 ; F28F21/00 ; F21V29/00 ; B23P15/26 ; B21D53/02

Abstract:
The present invention discloses a manufacturing method of heat-dissipating element, including the following steps: processing a heat-dissipating element body with a bottom plate and at least two stop plates, the stop plates being disposed at two sides of the bottom plate and bending towards surface; cutting from the bottom plate of the heat-dissipating element body to form heat-dissipating element, the dissipating element at least comprising two heat-dissipating elements of same shape or of symmetric shape. The present invention also discloses a heat-dissipating element and backlight module manufactured by the above method. The heat-dissipating element, manufacturing method and backlight module thereof can maintain optimal heat-dissipation effect and save material used to lower cost.
Public/Granted literature
- US20140111971A1 HEAT-DISSIPATING ELEMENT, MANUFACTURING METHOD AND BACKLIGHT MODULE THEREOF Public/Granted day:2014-04-24
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