The invention relates to a device for coating substrates having a process chamber (1) disposed in a reactor housing and a two-part, substantially cup-shaped susceptor (2, 3) disposed therein, forming an upper susceptor part (2) with the cup floor thereof having a flat plate (2′) and a lower susceptor part (3) with the cup side walls thereof, the outer side (4) of the plate (2′) of the upper susceptor part (2) facing upwards toward the process chamber (1) and forming a contact surface for at least one substrate, the upper susceptor part (2) contacting a front edge (3″) of the lower susceptor part (3) at the edge of said upper susceptor part (2), the lower susceptor part (3) being supported by a susceptor carrier (6), and heating zones (A, B, C) for heating the upper susceptor part (2) being disposed below the plate (2′). An advantageous refinement of the invention proposes that the upper susceptor part (2) be removable from the process chamber (1) separately from the lower susceptor part (3), and the joint (30) between the edge of the upper susceptor part (2) and the front edge (3″) of the lower susceptor part (3) be formed as a heat conduction barrier.