Invention Grant
- Patent Title: Attachment of microelectronic components
- Patent Title (中): 附件微电子元件
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Application No.: US13755409Application Date: 2013-01-31
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Publication No.: US08987052B2Publication Date: 2015-03-24
- Inventor: Ralph Kevin Smith
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: HolzerIPLaw, PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00
Abstract:
Sub-micron precision alignment between two microelectronic components can be achieved by applying energy to incite an exothermic reaction in alternating thin film reactive layers between the two microelectronic components. Such a reaction rapidly distributes localized heat to melt a solder layer and form a joint without significant shifting of components.
Public/Granted literature
- US20140210110A1 ATTACHMENT OF MICROELECTRONIC COMPONENTS Public/Granted day:2014-07-31
Information query
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