发明授权
- 专利标题： Attachment of microelectronic components
- 专利标题（中）： 附件微电子元件
-
申请号： US13755409申请日： 2013-01-31
-
公开(公告)号： US08987052B2公开(公告)日： 2015-03-24
- 发明人: Ralph Kevin Smith
- 申请人： Seagate Technology LLC
- 申请人地址： US CA Cupertino
- 专利权人： Seagate Technology LLC
- 当前专利权人： Seagate Technology LLC
- 当前专利权人地址： US CA Cupertino
- 代理机构： HolzerIPLaw, PC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00
摘要：
Sub-micron precision alignment between two microelectronic components can be achieved by applying energy to incite an exothermic reaction in alternating thin film reactive layers between the two microelectronic components. Such a reaction rapidly distributes localized heat to melt a solder layer and form a joint without significant shifting of components.
公开/授权文献
- US20140210110A1 ATTACHMENT OF MICROELECTRONIC COMPONENTS 公开/授权日：2014-07-31