Invention Grant
- Patent Title: Structure of light emitting diode and method to assemble thereof
- Patent Title (中): 发光二极管的结构及其组装方法
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Application No.: US13095059Application Date: 2011-04-27
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Publication No.: US08987770B2Publication Date: 2015-03-24
- Inventor: Sheng-Jia Sheu , Chien-Chang Pei
- Applicant: Sheng-Jia Sheu , Chien-Chang Pei
- Applicant Address: TW
- Assignee: Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Electronics Co., Ltd.
- Current Assignee Address: TW
- Agency: Han IP Corporation
- Priority: TW96106508A 20070226
- Main IPC: H01L33/36
- IPC: H01L33/36 ; H05K3/32 ; H01L33/62 ; H05K3/20

Abstract:
A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.
Public/Granted literature
- US20110198663A1 STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF Public/Granted day:2011-08-18
Information query
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