发明授权
- 专利标题： Integrated antenna for RFIC package applications
- 专利标题（中）： 用于RFIC封装应用的集成天线
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申请号： US13029657申请日： 2011-02-17
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公开(公告)号： US08988299B2公开(公告)日： 2015-03-24
- 发明人: Dong G. Kam , Duixian Liu , Scott K. Reynolds
- 申请人： Dong G. Kam , Duixian Liu , Scott K. Reynolds
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 Anne V. Dougherty
- 主分类号： H01Q13/10
- IPC分类号： H01Q13/10 ; H01Q19/10 ; H01Q1/22 ; H01Q3/30 ; H01Q9/04 ; H01Q9/06 ; H01Q21/06 ; H01L23/66 ; H01L23/00
摘要：
A chip package includes a plurality of layers including conductive planes connected by vias. The layers include a first portion having an antenna formed therein and a parallel-plate mode suppression mechanism to suppress parallel-plate mode excitation of the antenna. The parallel-plate mode suppression mechanism includes a reflector offset from an antenna ground plane and first grounded vias. A second portion has an interface for connecting to an integrated circuit device wherein the first portion and the second portion are separated by the parallel-plate mode suppression mechanism.
公开/授权文献
- US20120212384A1 INTEGRATED ANTENNA FOR RFIC PACKAGE APPLICATIONS 公开/授权日：2012-08-23
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