Invention Grant
- Patent Title: Grounding arrangement and method for a shielded cable
- Patent Title (中): 屏蔽电缆的接地布置和方法
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Application No.: US13795046Application Date: 2013-03-12
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Publication No.: US08991045B2Publication Date: 2015-03-31
- Inventor: Eric B. Poma , Bruce D. Taylor , Ronald A. Baldwin , Kenneth B. Germ
- Applicant: Delphi Technologies, Inc.
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Patrick M. Griffin
- Main IPC: H01R43/04
- IPC: H01R43/04 ; H01R9/05

Abstract:
A method is provided for forming a grounding arrangement on a shielded cable which includes a conductive core, a core insulation layer, a conductive shield layer, and an outer insulation layer. An inner ferrule is positioned adjacent an end portion of the conductive shield layer that has been exposed, the inner ferrule is crimped around the core insulation layer, and the end portion is folded over the inner ferrule to radially surround the inner ferrule. An electrically conductive outer ferrule is positioned radially adjacent to the end portion and the outer ferrule is crimped radially around the inner ferrule to capture the end portion radially between the inner ferrule and the outer ferrule, thereby fixing the outer ferrule in electrical contact with the conductive shield layer.
Public/Granted literature
- US20140259660A1 GROUNDING ARRANGEMENT AND METHOD FOR A SHIELDED CABLE Public/Granted day:2014-09-18
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